Patent Assignment
Reel/Frame 047422/0623
Assignment of Assignor's Interest
Recorded: 2018-11-06
Pages: 3
Assignors
TSAI, KUO-CHIANG
Executed: 2018-10-26
SU, FU-HSIANG
Executed: 2018-10-26
YU, KE-JING
Executed: 2018-10-26
CHEN, JYH-HUEI
Executed: 2018-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Insulating Cap on Contact Structure and Method for Forming the Same