Patent Assignment
Reel/Frame 047466/0255
Assignment of Assignor's Interest
Recorded: 2018-11-09
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2018-10-26
YEH, SUNG-FENG
Executed: 2018-10-26
CHEN, MING-FA
Executed: 2018-10-26
CHEN, HSIEN-WEI
Executed: 2018-10-26
LIU, TZUAN-HORNG
Executed: 2018-10-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Integrated Circuit Package and Method