Patent Assignment
Reel/Frame 047554/0226
Assignment of Assignor's Interest
Recorded: 2018-11-20
Pages: 5
Assignors
LIU, KUO-YEN
Executed: 2016-03-18
YEH, BOO
Executed: 2016-03-16
LIANG, MIN-CHANG
Executed: 2016-03-17
LAI, JUI-YAO
Executed: 2016-04-20
YEONG, SAI-HOOI
Executed: 2016-03-18
CHEN, YING-YAN
Executed: 2016-03-18
CHEN, YEN-MING
Executed: 2016-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device with Multi Wire Structure