Patent Assignment
Reel/Frame 047586/0400
RELEASE OF SECURITY INTEREST
Recorded: 2018-11-16
Received: 2018-11-16
Pages: 40
Assignor
BANK OF AMERICA, N.A.
Executed: 2018-11-15
Assignees
CABOT MICROELECTRONICS CORPORATION
870 NORTH COMMON DRIVE, AURORA, IL, 60504, UNITED STATES
NEXPLANAR CORPORATION
870 NORTH COMMON DRIVE, AURORA, IL, 60504, UNITED STATES
Covered Applications
(62)
TECHNIQUES FOR PROVIDING ADAPTIVE POWER DISTRIBUTION USING A MULTI-NODE NETWORK OF POWER FEED BRANCHING UNITS (PFBUs) AND AN UNDERSEA OPTICAL COMMUNICATION SYSTEM USING SAME
App. No. 15/461,448
→
COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING
PCTPCTUS2015060343
→
POLISHING PAD WITH FOUNDATION LAYER AND WINDOW ATTACHED THERETO
App. No. 14/931,737
→
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
App. No. 14/875,513
→
GROOVED CMP PADS
App. No. 14/874,179
→
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
App. No. 14/823,956
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/736,568
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/732,497
→
POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 14/727,586
→
COATED COMPRESSIVE SUBPAD FOR CHEMICAL MECHANICAL POLISHING
App. No. 14/635,973
→
LOW DENSITY POLISHING PAD
App. No. 14/611,064
→
POLISHING PAD WITH ALIGNMENT FEATURE
App. No. 14/610,991
→
METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS
App. No. 14/562,589
→
METHOD OF FABRICATING A POLISHING
App. No. 14/550,129
→
DOUBLE COATED COMPRESSIVE FOAM SUBPAD
App. No. 62/083,101
→
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON
App. No. 14/530,534
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 14/489,177
→
LOW DENSITY POLISHING PAD
PCTPCTUS2014047065
→
POLISHING PAD HAVING POROGENS WITH LIQUID FILLER
App. No. 14/307,846
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS
PCTPCTUS2014020754
→
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
App. No. 14/183,894
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
PCTPCTUS2014011792
→
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 14/152,792
→
Polishing Pad for Eddy Current End-Point Detection
App. No. 14/099,655
→
LOW DENSITY POLISHING PAD
App. No. 13/955,398
→
POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER
PCTPCTUS2013043126
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS HAVING TAPERED SIDEWALLS
App. No. 13/829,990
→
POLISHING SYSTEMS
App. No. 13/757,163
→
POLISHING PAD HAVING POLISHING SURFACE WITH CONTINUOUS PROTRUSIONS
App. No. 13/747,139
→
METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS
App. No. 13/612,135
→
POLISHING PAD WITH APERTURE
PCTPCTUS2012046037
→
POLISHING PAD WITH POLISHING SURFACE LAYER HAVING AN APERTURE OR OPENING ABOVE A TRANSPARENT FOUNDATION LAYER
App. No. 13/488,149
→
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON
PCTPCTUS2012038212
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
PCTPCTUS2012038211
→
POLISHING PAD WITH ALIGNMENT FEATURE
PCTPCTUS2012034717
→
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
PCTPCTUS2012021899
→
POLISHING PAD WITH FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 13/306,845
→
POLISHING PAD WITH GROOVED FOUNDATION LAYER AND POLISHING SURFACE LAYER
App. No. 13/306,849
→
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
PCTPCTUS2011055796
→
POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
PCTPCTUS2011053678
→
POLISHING PAD WITH ALIGNMENT APERTURE
App. No. 13/184,395
→
POLISHING PAD WITH HOMOGENEOUS BODY HAVING DISCRETE PROTRUSIONS THEREON
App. No. 13/113,655
→
POLISHING PAD WITH ALIGNMENT FEATURE
App. No. 13/101,826
→
POLISHING PAD WITH CONCENTRIC OR APPROXIMATELY CONCENTRIC POLYGON GROOVE PATTERN
App. No. 13/014,630
→
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
PCTPCTUS2011020840
→
CMP PAD WITH LOCAL AREA TRANSPARENCY
PCTPCTUS2011020870
→
POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS
App. No. 12/979,123
→
POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 12/895,465
→
METHOD OF FABRICATING A POLISHING PAD WITH AN END-POINT DETECTION REGION FOR EDDY CURRENT END-POINT DETECTION
App. No. 12/895,529
→
HOMOGENEOUS POLISHING PAD FOR EDDY CURRENT END-POINT DETECTION
App. No. 12/895,479
→
SOFT POLISHING PAD FOR POLISHING A SEMICONDUCTOR SUBSTRATE
App. No. 12/832,908
→
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
App. No. 12/767,712
→
CMP pad with local area transparency
App. No. 12/657,135
→
POLISHING SYSTEMS
App. No. 12/456,546
→
Grooved CMP pad
App. No. 12/381,709
→
Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
App. No. 11/884,829
→
Customized polishing pads for CMP and methods of fabrication and use thereof
App. No. 11/998,319
→
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
App. No. 11/998,196
→
DETACHABLE CLEARANCE WANDS
App. No. 11/392,510
→
CUSTOMIZED POLISHING PADS FOR CMP AND METHODS OF FABRICATION AND USE THEREOF
App. No. 11/251,547
→
METHODS FOR PRODUCING IN-SITU GROOVES IN CHEMICAL MECHANICAL PLANARIZATION (CMP) PADS, AND NOVEL CMP PAD DESIGNS
App. No. 10/897,192
→
CUSTOMIZED POLISH PADS FOR CHEMICAL MECHANICAL PLANARIZATION
App. No. 10/810,070
→