Patent Assignment
Reel/Frame 047607/0203
Assignment of Assignor's Interest
Recorded: 2018-11-28
Pages: 3
Assignors
MOLLA, JAYNAL A.
Executed: 2018-11-27
VISWANATHAN, LAKSHMINARAYAN
Executed: 2018-11-27
MAALOUF, ELIE A.
Executed: 2018-11-27
TUCKER, GEOFFREY
Executed: 2018-11-27
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE, AUSTIN, TEXAS, 78735
Covered Property
(1)
Microelectronic Modules with Sinter-Bonded Heat Dissipation Structures and Methods for the Fabrication Thereof