Patent Assignment
Reel/Frame 047704/0538
Assignment of Assignor's Interest
Recorded: 2018-12-07
Pages: 4
Assignors
LIN, TA-CHUN
Executed: 2018-11-26
CHUANG, TIEN-SHAO
Executed: 2018-11-26
TAI, KUANG-CHENG
Executed: 2018-11-26
CHEN, CHUN-HUNG
Executed: 2018-11-26
HSIEH, CHIH-HUNG
Executed: 2018-11-26
PAN, KUO-HUA
Executed: 2018-11-25
LIAW, JHON-JHY
Executed: 2018-11-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Isolation with Multi-Step Structure for Finfet Device and Method of Forming the Same