Patent Assignment
Reel/Frame 047751/0157
Assignment of Assignor's Interest
Recorded: 2018-12-12
Pages: 3
Assignors
LU, HUI-TING
Executed: 2018-11-07
WANG, PEI-LUN
Executed: 2018-11-07
JONG, YU-CHANG
Executed: 2018-11-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Chip and Method of Forming the Same