Patent Assignment
Reel/Frame 047762/0877
Assignment of Assignor's Interest
Recorded: 2018-12-13
Pages: 4
Assignor
THE DOW CHEMICAL COMPANY
Executed: 2014-10-28
Assignee
DOW GLOBAL TECHNOLOGIES LLC
2040 DOW CENTER, MIDLAND, MICHIGAN, 48674
Covered Properties
(2)
Heat Moldable Ceramic Composition
Heat Moldable Ceramic Composition
Application:
61/928,012 →
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 13, 2018
From: BAYER, ROLAND; WAGNER, ANETTE
To: DOW WOLFF CELLULOSICS GMBH & CO. OHG
Reel/Frame 047762/0789 →
Assignment of Assignor's Interest
Dec 13, 2018
From: DOW WOLFF CELLULOSICS GMBH & CO. OHG
To: THE DOW CHEMICAL COMPANY
Reel/Frame 047762/0837 →
Change of Legal Entity
Nov 28, 2020
From: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
To: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC.
Reel/Frame 054530/0384 →
Assignment of Assignor's Interest
Nov 28, 2020
From: DOW GLOBAL TECHNOLOGIES LLC
To: THE DOW CHEMICAL COMPANY
Reel/Frame 054531/0001 →
Assignment of Assignor's Interest
Nov 28, 2020
From: THE DOW CHEMICAL COMPANY
To: DDP SPECIALTY ELECTRONIC MATERIALS US, INC.
Reel/Frame 054533/0001 →
Assignment of Assignor's Interest
Nov 28, 2020
From: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC.
To: NUTRITION & BIOSCIENCES USA 1, LLC
Reel/Frame 054533/0575 →