Patent Assignment
Reel/Frame 047846/0866
Assignment of Assignor's Interest
Recorded: 2018-12-21
Pages: 3
Assignors
MAO, YI-CHAO
Executed: 2018-12-13
CHANG, CHIN-CHUAN
Executed: 2018-12-13
LU, SZU-WEI
Executed: 2018-12-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Structure and Formation Method of Package Structure with Stacked Semiconductor Dies