Patent Assignment
Reel/Frame 047866/0200
Assignment of Assignor's Interest
Recorded: 2018-12-28
Pages: 5
Assignors
HORIBE, AKIHIRO
Executed: 2017-09-19
KOHDA, YASUTERU
Executed: 2017-09-19
MUNETOH, SEIJI
Executed: 2017-09-19
SUBRAMANIAN, CHITRA
Executed: 2017-09-19
SUEOKA, KUNIAKI
Executed: 2017-09-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Wafer Scale Testing and Initialization of Small Die Chips
Application:
16/234,852 →
Publication:
US 2019/0139840
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.