Patent Assignment
Reel/Frame 047967/0524
Employment Agreement
Recorded: 2018-12-20
Pages: 9
Assignor
HOU, XIANGYOU
Executed: 2016-07-06
Assignee
SHENZHEN AMI TECHNOLOGY CO., LTD.
1/F, H2 BUILDING, HONGFA HI-TECH INDUSTRIAL PARK, TANGTOU BLVD., SHIYAN, BAOAN DISTRICT, SHENZHEN, CHINA
Covered Property
(1)
Positioning Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2018
From: ZENG, QINGLONG; LU, ROBERTO FRANCISCO-YI; CHEN, SONGPING; DAI, ZHIYONG
To: TYCO ELECTRONICS (SHANGHAI) CO. LTD.; TE CONNECTIVITY CORPORATION; SHENZHEN AMI TECHNOLOGY CO., LTD.; MEASUREMENT SPECIALTIES (CHINA) LTD.
Reel/Frame 047302/0073 →
Assignment of Assignor's Interest
Jun 17, 2021
From: TE CONNECTIVITY CORPORATION
To: TE CONNECTIVITY SERVICES GMBH
Reel/Frame 057197/0543 →
Merger
Apr 28, 2022
From: TE CONNECTIVITY SERVICES GMBH
To: TE CONNECTIVITY SOLUTIONS GMBH
Reel/Frame 060885/0482 →