Patent Assignment
Reel/Frame 048205/0020
Assignment of Assignor's Interest
Recorded: 2019-01-31
Pages: 3
Assignor
LIN, KEVIN
Executed: 2018-06-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Core Fill to Reduce Dishing and Metal Pillar Fill to Increase Metal Density of Interconnects
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.