Patent Assignment
Reel/Frame 048239/0216
Assignment of Assignor's Interest
Recorded: 2019-02-05
Pages: 6
Assignors
NOVACK, ARI
Executed: 2019-02-05
FATHOLOLOUMI, SAEED
Executed: 2019-01-29
CAVERLEY, MICHAEL
Executed: 2019-02-04
Assignee
ELENION TECHNOLOGIES, LLC
171 MADISON AVENUE, SUITE 1100, NEW YORK, NEW YORK, 10016
Covered Property
(1)
Flip Chip Bonding Onto a Photonic Integrated Circuit
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.