Patent Assignment
Reel/Frame 048469/0739
Assignment of Assignor's Interest
Recorded: 2019-02-28
Pages: 4
Assignors
WANG, JHIH-YU
Executed: 2019-02-15
CHU, YUNG-CHI
Executed: 2019-02-15
LIAO, SIH-HAO
Executed: 2019-02-15
HU, YU-HSIANG
Executed: 2019-02-15
KUO, HUNG-JUI
Executed: 2019-01-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Forming Semiconductor Device