Patent Assignment
Reel/Frame 048474/0882
Assignment of Assignor's Interest
Recorded: 2019-03-01
Pages: 3
Assignors
PARK, SUNGWON
Executed: 2019-02-20
LEE, SEUNGYUP
Executed: 2019-02-20
JUNG, HESUK
Executed: 2019-02-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Electronic Device Including Rigid-Flex Circuit Board