Patent Assignment
Reel/Frame 048643/0020
Assignment of Assignor's Interest
Recorded: 2019-03-20
Pages: 3
Assignee
SONY CORPORATION
1-7-1 KONAN,, MINATO-KU,, TOKYO, 108-0075, JAPAN
Covered Property
(1)
Infrastructure Equipment, Wireless Telecommunications System and Method for Harq-Ack Bundling