Patent Assignment
Reel/Frame 048663/0477
Assignment of Assignor's Interest
Recorded: 2019-03-21
Pages: 4
Assignors
YEH, CHIEN CHAN
Executed: 2019-01-04
KUO, YING-CHIH
Executed: 2019-01-04
LIN, WEI-FENG
Executed: 2019-01-11
Assignee
OMNIVISION TECHNOLOGIES, INC
4275 BURTON DRIVE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same