Patent Assignment
Reel/Frame 048663/0669
Assignment of Assignor's Interest
Recorded: 2019-03-21
Pages: 2
Assignor
WU, YOUHONG
Executed: 2019-02-07
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board