IP Library › Assignment 048716/0994
Patent Assignment
Reel/Frame 048716/0994

Assignment of Assignor's Interest

Recorded: 2019-03-27 Pages: 5
Assignors
ARTMAN, PAUL
Executed: 2019-03-25
JUNKINS, ANDREW THOMAS
Executed: 2019-03-26
Assignee
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
151, LORONG CHUAN, #02-01, NEW TECH PARK, 556741, SINGAPORE
Covered Property (1)
Systems and Methods for Cooling an Electronic Device via Interface of a Heat-Transfer Conduit of the Electronic Device to a Cold Plate Assembly
Application: 16/366,000 →
Publication: US 2020/0315066
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 20, 2025
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD.
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD.
Reel/Frame 070267/0128 →
Assignment of Assignor's Interest Feb 20, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 070269/0207 →