Patent Assignment
Reel/Frame 048783/0308
Assignment of Assignor's Interest
Recorded: 2019-04-03
Pages: 6
Assignors
SHI, HONGBIN
Executed: 2018-10-23
YE, RUNQING
Executed: 2018-10-29
LONG, HAOHUI
Executed: 2018-10-28
Assignee
HUAWEI TECHNOLOGIES CO., LTD.
HUAWEI ADMINISTRATION BUILDING, BANTIAN, LONGGANG DISTRICT, SHENZHEN, 518129, CHINA
Covered Property
(1)
High-Reliability Electronic Packaging Structure, Circuit Board, and Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.