Patent Assignment
Reel/Frame 048821/0591
Assignment of Assignor's Interest
Recorded: 2019-04-08
Pages: 3
Assignors
PARIS, BERTRAND
Executed: 2019-03-27
PIECH, GARRETT ANDREW
Executed: 2019-03-22
WIELAND, KRISTOPHER ALLEN
Executed: 2019-03-25
Assignee
CORNING INCORPORATED
SP-TI-3-1, CORNING, NEW YORK, 14831
Covered Property
(1)
Methods for Forming Holes in Substrates
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.