Patent Assignment
Reel/Frame 048890/0010
Assignment of Assignor's Interest
Recorded: 2019-04-16
Pages: 6
Assignors
TAI, CHIH-HSUAN
Executed: 2019-03-08
TSAI, HAO-YI
Executed: 2019-03-20
CHIANG, TSUNG-HSIEN
Executed: 2019-03-08
HUANG, YU-CHIH
Executed: 2019-03-08
LIU, CHIA-HUNG
Executed: 2019-03-13
WU, BAN-LI
Executed: 2019-03-13
TSENG, YING-CHENG
Executed: 2019-03-13
LIN, PO-CHUN
Executed: 2019-03-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Forming the Same