Patent Assignment
Reel/Frame 049039/0743
Assignment of Assignor's Interest
Recorded: 2019-04-30
Pages: 5
Assignee
BOE TECHNOLOGY GROUP CO., LTD.
NO. 10 JIUXIANQIAO RD., CHAOYANG DISTRICT, BEIJING, 100015, CHINA
Covered Property
(1)
Method for Manufacturing Array Substrate Including Forming via Holes Having Different Widths Using Single Patterning Process