Patent Assignment
Reel/Frame 049127/0494
Assignment of Assignor's Interest
Recorded: 2019-05-09
Pages: 4
Assignors
WU, YI-WEN
Executed: 2019-04-30
WONG, TECHI
Executed: 2019-04-30
TSAI, PO-HAO
Executed: 2019-04-30
CHUANG, PO-YAO
Executed: 2019-04-30
HUNG, SHIH-TING
Executed: 2019-04-30
JENG, SHIN-PUU
Executed: 2019-04-30
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package with Improved Interposer Structure