Patent Assignment
Reel/Frame 049134/0397
Assignment of Assignor's Interest
Recorded: 2019-05-09
Pages: 5
Assignors
LIU, CHIN-KUAN
Executed: 2017-11-06
WANG, CHAO-LUNG
Executed: 2017-11-06
CHANG, SHUO-HSUN
Executed: 2017-11-06
LU, YU-TE
Executed: 2017-11-06
CHANG, CHIN-HSI
Executed: 2017-11-06
Assignee
KINSUS INTERCONNECT TECHNOLOGY CORP.
1245 ZHONGHUA ROAD, XINWU DISTRICT, TAOYUAN CITY, 327, TAIWAN
Covered Property
(1)
Method for Manufacturing a Multi-Layer Circuit Board Capable of Being Applied with Electrical Testing