Patent Assignment
Reel/Frame 049164/0775
Assignment of Assignor's Interest
Recorded: 2019-05-14
Pages: 4
Assignors
CHEN, YING-JU
Executed: 2019-04-29
CHEN, HSIEN-WEI
Executed: 2019-04-29
CHEN, MING-FA
Executed: 2019-04-29
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Manufacturing the Same