Patent Assignment
Reel/Frame 049305/0309
Assignment of Assignor's Interest
Recorded: 2019-05-29
Pages: 2
Assignors
WENG, SSU-CHIANG
Executed: 2019-05-15
LIN, PING-HAO
Executed: 2019-05-15
CHANG, FU-CHENG
Executed: 2019-04-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Protection Structures for Bonded Wafers