Patent Assignment
Reel/Frame 049478/0343
Assignment of Assignor's Interest
Recorded: 2019-06-14
Pages: 5
Assignors
KUO, TSUNG-SHENG
Executed: 2019-05-08
LIU, HSU-SHUI
Executed: 2019-05-08
PAI, JIUN-RONG
Executed: 2019-05-08
CHU, YANG-ANN
Executed: 2019-05-08
LIN, CHIH-CHUN
Executed: 2019-05-08
CHEN, SHINE
Executed: 2019-05-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Integrated Semiconductor Die Parceling Platforms