Assignment of Assignor's Interest

Recorded: 2019-06-18 Pages: 4

Assignors

AUGUSTIN, ANDREAS

Executed: 2018-07-17

SEIDEMANN, GEORG

Executed: 2018-07-12

WAGNER, THOMAS

Executed: 2018-07-11

WAIDHAS, BERND

Executed: 2018-07-11

Assignee

INTEL IP CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Through-Silicon via Pillars for Connecting Dice and Methods of Assembling Same

Application: 16/024,413 →

Publication: US 2020/0006272

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.