Patent Assignment
Reel/Frame 049533/0873
Assignment of Assignor's Interest
Recorded: 2019-06-20
Pages: 4
Assignors
WAGNER, THOMAS
Executed: 2017-11-07
WOLTER, ANDREAS
Executed: 2017-11-07
SEIDEMANN, GEORG
Executed: 2017-11-07
Assignee
INTEL IP CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Interconnect Structure for Stacked Die in a Microelectronic Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.