Patent Assignment
Reel/Frame 049569/0005
Assignment of Assignor's Interest
Recorded: 2019-06-24
Pages: 8
Assignors
PJENCAK, JAROSLAV
Executed: 2019-06-24
AGAM, MOSHE
Executed: 2019-06-21
JANSSENS, JOHAN CAMIEL JULIA
Executed: 2019-06-21
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 E. MCDOWELL ROAD, MAILDROP A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
High Voltage Diode on Soi Substrate with Trench-Modified Current Path
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 23, 2019
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 050156/0421 →
Assignment of Assignor's Interest
Mar 4, 2021
From: PJENCAK, JAROSLAV
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 055493/0345 →
Release of Security Interest in Patents Previously Recorded at Reel 050156, Frame 0421
Aug 16, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 064615/0639 →