IP Library › Assignment 049676/0276
Patent Assignment
Reel/Frame 049676/0276

Assignment of Assignor's Interest

Recorded: 2019-07-05 Pages: 6
Assignors
CHOI, JAE SIK
Executed: 2019-06-28
KIM, DO YOUNG
Executed: 2019-06-28
JEONG, JIN WON
Executed: 2019-06-28
LEE, HYE JI
Executed: 2019-06-28
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, CHEONGJU-SI, 28429, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package with Inner Lead Pattern Group and Method for Manufacturing the Semiconductor Package
Application: 16/503,897 →
Publication: US 2020/0286817
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →