Patent Assignment
Reel/Frame 049689/0652
Assignment of Assignor's Interest
Recorded: 2019-07-08
Pages: 2
Assignors
YU, CHEN-HUA
Executed: 2019-06-03
WU, JIUN YI
Executed: 2019-06-10
HSIA, HSING-KUO
Executed: 2019-06-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Integrated Circuit Package and Method