Patent Assignment
Reel/Frame 049730/0886
Assignment of Assignor's Interest
Recorded: 2019-07-11
Pages: 2
Assignors
INOUE, KEISUKE
Executed: 2019-06-24
KONDO, SHUNSUKE
Executed: 2019-06-24
OTSUKA, YUYA
Executed: 2019-06-24
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Cmp Polishing Solution and Polishing Method
Application:
16/308,009 →
Publication:
US 2019/0256741