Patent Assignment
Reel/Frame 049735/0390
Assignment of Assignor's Interest
Recorded: 2019-07-12
Pages: 4
Assignors
LIN, WEN-YI
Executed: 2019-07-03
YANG, CHE-CHIA
Executed: 2019-07-03
LEE, KUANG-CHUN
Executed: 2019-07-03
LIN, YU-SHENG
Executed: 2019-07-05
LIN, PO-YAO
Executed: 2019-07-04
JENG, SHIN-PUU
Executed: 2019-07-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method for Forming Package Structure
Patent:
10,790,164 →
Application:
16/439,944 →