Patent Assignment
Reel/Frame 049800/0655
Assignment of Assignor's Interest
Recorded: 2019-07-19
Pages: 7
Assignors
KANG, SUNG-GIL
Executed: 2019-06-19
PARK, MIN-SEOP
Executed: 2019-06-19
KIM, GON-JUN
Executed: 2019-06-19
BAEK, JAE-JIK
Executed: 2019-06-05
SHIN, JAE-JIN
Executed: 2019-06-05
JEONG, IN-HYE
Executed: 2019-06-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Processing Apparatus, Signal Source Device, Method of Processing Material Layer, and Method of Fabricating Semiconductor Device