Patent Assignment
Reel/Frame 049872/0114
Assignment of Assignor's Interest
Recorded: 2019-03-14
Pages: 3
Assignee
MULTI-PACK SOLUTIONS LLC
1804 WEST CENTRAL ROAD, MT. PROSPECT, ILLINOIS, 60056
Covered Property
(1)
Systems and Methods for Forming Dual Layer Water Soluble Packets
Related Assignments
(10)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 14, 2019
From: MULTI-PACK SOLUTIONS LLC
To: MULTI-PACK CHICAGO LLC
Reel/Frame 050141/0907 →
Change of Name
Aug 9, 2019
From: MULTI-PACK SOLUTIONS LLC
To: MULTI-PACK CHICAGO LLC
Reel/Frame 050018/0881 →
Assignment for Security -- Patents
Oct 31, 2019
From: MULTI-PACK CHICAGO LLC
To: SJC DLF III-Q, LLC, AS COLLATERAL AGENT
Reel/Frame 050897/0535 →
Change of Name
Mar 26, 2021
From: MULTI-PACK CHICAGO LLC
To: NEW USN CHICAGO, LLC
Reel/Frame 055746/0804 →
Change of Name
Mar 26, 2021
From: NEW USN CHICAGO, LLC
To: RADIENZ LIVING CHICAGO, LLC
Reel/Frame 055745/0988 →
Change of Name
Mar 27, 2021
From: NEW U.S. NONWOVENS LLC
To: RADIENZ LIVING, LLC
Reel/Frame 055746/0114 →
Security Interest
Jun 11, 2021
From: RADIENZ LIVING CHICAGO, LLC
To: SJC DLF III-Q, LLC, AS COLLATERAL AGENT
Reel/Frame 056514/0642 →
Assignment of Assignor's Interest
Feb 17, 2023
From: RADIENZ LIVING, LLC
To: NEW SPS POD, LLC
Reel/Frame 062729/0270 →
Security Interest
Feb 17, 2023
From: NEW SPS POD, LLC; NEW SPS CROSSFOLDS, LLC
To: SJC DLF III-Q, LLC
Reel/Frame 062729/0854 →
Confirmatory Patent Assignment
Mar 9, 2023
From: RADIENZ LIVING, LLC; RADIENZ LIVING CHICAGO, LLC
To: NEW SPS POD, LLC
Reel/Frame 063009/0711 →