Patent Assignment
Reel/Frame 049887/0266
Assignment of Assignor's Interest
Recorded: 2019-07-29
Pages: 4
Assignors
VINCENT, MICHAEL B.
Executed: 2019-07-29
HAYES, SCOTT M.
Executed: 2019-07-26
GONG, ZHIWEI
Executed: 2019-07-26
HOOPER, STEPHEN RYAN
Executed: 2019-07-26
Assignee
NXP USA, INC.
6501 WILLIAM CANNON DRIVE, AUSTIN, TEXAS, 78735
Covered Property
(1)
Method, System, and Apparatus for Forming Three-Dimensional Semiconductor Device Package with Waveguide