Patent Assignment
Reel/Frame 049953/0950
Assignment of Assignor's Interest
Recorded: 2019-08-05
Pages: 5
Assignors
HUANG, CHIH-FAN
Executed: 2019-04-26
CHEN, HUI-CHI
Executed: 2019-04-26
CHANG, KUO-CHIN
Executed: 2019-04-30
CHEN, DIAN-HAU
Executed: 2019-04-26
CHEN, YEN-MING
Executed: 2019-04-26
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Multi-Layer Passivation Structure and Method