Patent Assignment
Reel/Frame 049962/0718
Assignment of Assignor's Interest
Recorded: 2019-08-05
Pages: 6
Assignors
LEE, JU-IK
Executed: 2019-06-20
KIM, DONG-WAN
Executed: 2019-06-20
SHIN, SEOK-HOSEAN
Executed: 2019-06-20
HAN, JUNG-HOON
Executed: 2019-06-20
PARK, SANG-OH
Executed: 2019-06-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip and Semiconductor Package Including the Same