Patent Assignment
Reel/Frame 050027/0686
Assignment of Assignor's Interest
Recorded: 2019-08-12
Pages: 6
Assignors
NA, DAE HOON
Executed: 2019-08-06
LEE, JANG WOO
Executed: 2019-08-06
BYUN, JIN DO
Executed: 2019-08-06
IHM, JEONG DON
Executed: 2019-08-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package