Patent Assignment
Reel/Frame 050071/0623
Assignment of Assignor's Interest
Recorded: 2019-08-16
Pages: 2
Assignors
SIO, KAM-TOU
Executed: 2019-07-12
TZENG, JIANN-TYNG
Executed: 2019-07-12
LIN, WEI-CHENG
Executed: 2019-07-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integrated Circuit Including Supervia and Method of Making