Patent Assignment
Reel/Frame 050103/0606
Assignment of Assignor's Interest
Recorded: 2019-08-20
Pages: 2
Assignors
LAI, TE-YANG
Executed: 2019-08-02
CHANG, CHE-HAO
Executed: 2019-08-02
CHUI, CHI ON
Executed: 2019-08-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Method of Gap Filling for Semiconductor Device