Patent Assignment
Reel/Frame 050159/0435
Assignment of Assignor's Interest
Recorded: 2019-08-25
Pages: 4
Assignor
LEE, JUN NOH
Executed: 2019-02-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Forming the Same