Patent Assignment
Reel/Frame 050263/0617
Assignment of Assignor's Interest
Recorded: 2019-09-04
Pages: 4
Assignors
CHEN, CHING-YI
Executed: 2019-08-06
LIN, SHENG-HSUAN
Executed: 2019-08-07
LOH, WEI-YIP
Executed: 2019-08-06
CHEN, HUNG-HSU
Executed: 2019-08-06
CHANG, CHIH-WEI
Executed: 2019-08-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Barrier-Free Approach For Forming Contact Plugs