Patent Assignment
Reel/Frame 050266/0327
Assignment of Assignor's Interest
Recorded: 2019-09-04
Pages: 2
Assignor
SODA, EIICHI
Executed: 2019-08-29
Assignee
TOSHIBA MEMORY CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, 105-0023, JAPAN
Covered Property
(1)
Method of Separating Bonded Substrate, Method of Manufacturing Semiconductor Storage Device, and Substrate Separation Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.