Patent Assignment
Reel/Frame 050282/0040
Assignment of Assignor's Interest
Recorded: 2019-09-05
Pages: 3
Assignor
NISHIUMI, KENGO
Executed: 2019-07-19
Assignee
SEKISUI PLASTICS CO., LTD.
4-4, NISHITENMA 2-CHOME, KITA-KU, OSAKA-SHI, OSAKA, 530-8565, JAPAN
Covered Property
(1)
Organic-Inorganic Composite Particles and Manufacturing Method Therefor, and Thermally Conductive Filler and Thermally Conductive Resin Composition and Manufacturing Method Therefor
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.