Patent Assignment
Reel/Frame 050288/0423
Assignment of Assignor's Interest
Recorded: 2019-09-06
Pages: 7
Assignors
UH, MIN-HEE
Executed: 2019-06-27
KANG, SUNG-MIN
Executed: 2019-06-27
KANG, JUN-GU
Executed: 2019-06-27
GO, SEUNG-HEE
Executed: 2019-06-27
KIM, YOUNG-MOK
Executed: 2019-06-27
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Chip, Method of Manufacturing the Integrated Circuit Chip, and Integrated Circuit Package and Display Apparatus Including the Integrated Circuit Chip