Patent Assignment
Reel/Frame 050304/0717
Assignment of Assignor's Interest
Recorded: 2019-05-28
Pages: 24
Assignor
SARNOFF CORPORATION
Executed: 2005-10-07
Assignee
TRANSPACIFIC IP LTD
14TH FL, NO 168 TUN HWA N. RD, TAIPEI, 105, TAIWAN
Covered Property
(1)
Low-Cost Circuit Board Materials and Processes for Area Array Electrical Interconnections Over a Large Area Between a Device and the Circuit Board
Patent:
41,669 →
Application:
11/699,322 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 23, 2007
From: PALANISAMY, PONNUSAMY
To: SARNOFF CORPORATION
Reel/Frame 019196/0823 →
Assignment of Assignor's Interest
Apr 23, 2007
From: SARNOFF CORPORATION
To: TRANSPACIFIC IP, LTD.
Reel/Frame 019196/0828 →
Assignment of Assignor's Interest
Jun 23, 2009
From: TRANSPACIFIC IP LTD.
To: TRANSPACIFIC INFINITY, LLC
Reel/Frame 022856/0281 →