Patent Assignment
Reel/Frame 050327/0992
Assignment of Assignor's Interest
Recorded: 2019-09-10
Pages: 3
Assignors
LIN, TA-CHUN
Executed: 2019-09-02
PAN, KUO-HUA
Executed: 2019-09-02
LIAW, JHON JHY
Executed: 2019-09-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Hybrid Nanostructure and Fin Structure Device